The objects in this MIB module are used to manage the
multi-pair bonded xDSL interfaces using time-division inverse
multiplexing (TDIM), as defined in ITU-T Recommendation G.998.3
(G.Bond/TDIM).

This MIB module MUST be used in conjunction with the GBOND-MIB
module, common to all G.Bond technologies.

The following references are used throughout this MIB module:

[G.998.3] refers to:
  ITU-T Recommendation G.998.3: 'Multi-pair bonding using
  time-division inverse multiplexing', January 2005.

[TR-159] refers to:
  Broadband Forum Technical Report: 'Management Framework for
  xDSL Bonding', December 2008.

Naming Conventions:
  BCE    - Bonding Channel Entity
  BTU    - Bonding Terminating Unit
  BTU-C  - Bonding Terminating Unit, CO side
  BTU-R  - Bonding Terminating Unit, Remote Terminal (CPE) side
  CO     - Central Office
  CPE    - Customer Premises Equipment
  GBS    - Generic Bonding Sub-layer
  GBS-C  - Generic Bonding Sub-layer, CO side
  GBS-R  - Generic Bonding Sub-layer, Remote Terminal (CPE) side
  SNR    - Signal to Noise Ratio

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