The objects in this MIB module are used to manage the
multi-pair bonded xDSL interfaces using time-division inverse
multiplexing (TDIM), as defined in ITU-T Recommendation G.998.3
This MIB module MUST be used in conjunction with the GBOND-MIB
module, common to all G.Bond technologies.
The following references are used throughout this MIB module:
[G.998.3] refers to:
ITU-T Recommendation G.998.3: 'Multi-pair bonding using
time-division inverse multiplexing', January 2005.
[TR-159] refers to:
Broadband Forum Technical Report: 'Management Framework for
xDSL Bonding', December 2008.
BCE - Bonding Channel Entity
BTU - Bonding Terminating Unit
BTU-C - Bonding Terminating Unit, CO side
BTU-R - Bonding Terminating Unit, Remote Terminal (CPE) side
CO - Central Office
CPE - Customer Premises Equipment
GBS - Generic Bonding Sub-layer
GBS-C - Generic Bonding Sub-layer, CO side
GBS-R - Generic Bonding Sub-layer, Remote Terminal (CPE) side
SNR - Signal to Noise Ratio
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