The objects in this MIB module are used to manage the
Ethernet-based multi-pair bonded xDSL interfaces, as defined in
ITU-T Recommendation G.998.2 (G.Bond/Ethernet).

This MIB module MUST be used in conjunction with the GBOND-MIB
module, common to all G.Bond technologies.

The following references are used throughout this MIB module:

[G.998.2] refers to:
  ITU-T Recommendation G.998.2: 'Ethernet-based multi-pair
  bonding', January 2005.

[G.998.2-Amd2] refers to:
  ITU-T Recommendation G.998.2 Amendment 2, December 2007.

[802.3] refers to:
  IEEE Std 802.3-2005: 'IEEE Standard for Information
  technology - Telecommunications and information exchange
  between systems - Local and metropolitan area networks -
  Specific requirements -

  Part 3: Carrier Sense Multiple Access with Collision
  Detection (CSMA/CD) Access Method and Physical Layer
  Specifications', December 2005.

[TR-159] refers to:
  Broadband Forum Technical Report: 'Management Framework for
  xDSL Bonding', December 2008.

Naming Conventions:
  BACP   - Bonding Aggregation Control Protocol
  BCE    - Bonding Channel Entity
  BTU    - Bonding Terminating Unit
  BTU-C  - Bonding Terminating Unit, CO side
  BTU-R  - Bonding Terminating Unit, Remote Terminal (CPE) side
  CO     - Central Office
  CPE    - Customer Premises Equipment
  GBS    - Generic Bonding Sub-layer
  HDLC   - High-level Data Link Control
  PTM-TC - Packet Transfer Mode Transmission Convergence
           (sub-layer)
  SNR    - Signal to Noise Ratio
  TC     - Transmission Convergence (sub-layer)
  UAS    - Unavailable Seconds

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authors of the code.  All rights reserved.

Redistribution and use in source and binary forms, with or without
modification, is permitted pursuant to, and subject to the license
terms contained in, the Simplified BSD License set forth in Section
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(http://trustee.ietf.org/license-info).