The objects in this MIB module are used to manage the
Ethernet-based multi-pair bonded xDSL interfaces, as defined in
ITU-T Recommendation G.998.2 (G.Bond/Ethernet).
This MIB module MUST be used in conjunction with the GBOND-MIB
module, common to all G.Bond technologies.
The following references are used throughout this MIB module:
[G.998.2] refers to:
ITU-T Recommendation G.998.2: 'Ethernet-based multi-pair
bonding', January 2005.
[G.998.2-Amd2] refers to:
ITU-T Recommendation G.998.2 Amendment 2, December 2007.
[802.3] refers to:
IEEE Std 802.3-2005: 'IEEE Standard for Information
technology - Telecommunications and information exchange
between systems - Local and metropolitan area networks -
Specific requirements -
Part 3: Carrier Sense Multiple Access with Collision
Detection (CSMA/CD) Access Method and Physical Layer
Specifications', December 2005.
[TR-159] refers to:
Broadband Forum Technical Report: 'Management Framework for
xDSL Bonding', December 2008.
BACP - Bonding Aggregation Control Protocol
BCE - Bonding Channel Entity
BTU - Bonding Terminating Unit
BTU-C - Bonding Terminating Unit, CO side
BTU-R - Bonding Terminating Unit, Remote Terminal (CPE) side
CO - Central Office
CPE - Customer Premises Equipment
GBS - Generic Bonding Sub-layer
HDLC - High-level Data Link Control
PTM-TC - Packet Transfer Mode Transmission Convergence
SNR - Signal to Noise Ratio
TC - Transmission Convergence (sub-layer)
UAS - Unavailable Seconds
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